1996 Conference Publications

This document will be updated when information on new publications becomes available.

12th Annual Review of Progress in Applied Computational Electromagnetics
March 18-22 1996, Monterey, California USA.

• L. de Menezes and W. J. R. Hoefer, "Modeling Gyromagnetic Media in Symmetrical Condensed Node TLM", pp 294-301. Abstract
• C. Eswarappa and W. J. R. Hoefer, "A Comparative Performance Study of Absorbing Boundary Conditions in TLM and FDTD", pp 302-309. Abstract
• L. Cascio, G. Tardioli, T. Rozzi and W. J. R. Hoefer, "Quasi Static Correction of a Knife Edge Corner in 2D TLM Algorithm", pp 317-324. Abstract

IEEE MTT-S International Microwave Symposium
June 16-21 1996, San Francisco, CA USA.

• L. Cascio, G. Tardioli, W. J. R. Hoefer and T. Rozzi, "A Quasi-Static Modification of TLM at Knife Edge and 90 Degree Wedge Singularities", WE1B-5, pp 443-446 (Vol. 2). Abstract
• M. Righi and W. J. R. Hoefer, "Efficient Hybrid TLM / Mode Matching Analysis of Packaged Components", WE1B-6, pp 447-450 (Vol. 2). Abstract
• L. de Menezes and W. J. R. Hoefer, "Accuracy of TLM Solutions of Maxwell's Equations", WE3F-53, pp 1019-1022 (Vol. 2). Abstract
• J. L. Herring and W. J. R. Hoefer, "Improved Excitation of 3D SCN TLM Based on Voltage Sources", WE3F-56, pp 1031-1034 (Vol. 2). Abstract
• Q. Zhang, W. J. R. Hoefer, J. Huang and K. Wu, "Dispersion Analysis of TLM Node for Modeling General Anisotropic and Gyromagnetic Materials", WE3F-58, pp 1039-1042 (Vol. 2). Abstract
• C. Eswarappa and W. J. R. Hoefer, "A Hybrid 3D TLM-FDTD Model of Microwave Fields", WE3F-64, pp 1063-1066 (Vol. 2). Abstract

IEEE Antennas and Propagation Society International Symposium
July 21-26, 1996, Baltimore, Maryland USA.
C. Eswarappa and W. J. R. Hoefer, "Real Time Interface Between 3D Expanded-TLM and Yee's FDTD Modules"

Symposium on Antenna Techology and Applied Electromagnetics
August 7-9, 1996.
Q. Zhang and W.J.R. Hoefer, "Analysis of 3-D planar structure by TLM cuboid condensed node", pp 235-239.

IEEE 5th Topical Meeting on Electrical Performance of Electronic Packaging
October 28-30, 1996, Napa, California USA.
W. J. R. Hoefer, "Time domain modeling of high-speed circuit structures with TLM", pp 196-198. Abstract